? 2017 littelfuse, inc. specifcations are subject to change without notice. revised: 02/23/17 description zener diodes fabricated in a proprietary silicon avalanche technology protect each i/o pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes above the maximum level specifed in the iec 61000-4-2 international standard (level 4, 8kv contact discharge) without performance degradation. their very low loading capacitance also makes them ideal for protecting high- speed signal pins. pinout functional block diagram features ? low capacitance of 8pf (typ) per i/o ? esd protection of 15kv contact discharge, 30kv air discharge, (level 4, iec 61000-4-2) ? eft protection, iec 61000-4-4, 40a (5/50ns) ? low leakage current of 0.5 to 0.1a (max) at 5v ? small package saves board space ? lightning protection, iec 61000-4-5, 2nd edition 2a (8/20s) ? aec-q101 qualifed (sc70-x packages) ? rohs compliant and lead- free applications ? computer peripherals ? mobile phones ? digital cameras ? desktops/notebooks ? lcd/pdp tvs ? set top boxes ? dvd players ? mp3/pmp *sp1 00 1 -02 (sc70-3) (sc70-5) (sc70-6) *sp1 00 1- 04 1 3 5 4 6 *sp1 00 1- 05 2 2 1 3 4 5 1 3 5 4 6 2 2 sp1 00 1 -02 (s ot 553 ) *note: aec-q101 quali?ed (s ot 553) sp1 00 1- 05 (s ot 563) sp1 00 1 -04 sp1 00 1- 05 (s ot 963) sp sp sp sp life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example shield ground sp 10 01 -04jtg (sc70-5) sp 10 01 -04xtg (so t553) outside w orld input lcd module controller d1 d2 d3 d4 signal ground sp1001 series - 8pf 15kv unidirectional tvs array additional information daasee saes resources tvs diode arrays (spa ? diodes) general purpose esd protection - sp1001 series
? 2017 littelfuse, inc. specifcations are subject to change without notice. revised: 02/23/17 absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 2 a t op operating temperature C40 to 125 c t stor storage temperature C55 to 150 c caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. electrical characteristics (t op = 25c) parameter symbol test conditions min typ max units forward voltage drop v f i f =10ma 0.7 0.9 1. 2 v reverse voltage drop v r i r =1ma 6.0 8.5 v reverse standoff voltage v rwm i r 1a 5.5 v reverse leakage current i leak v r =5v 0.1 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 8.0 11. 0 v i pp =2a, t p =8/20s, fwd 9.7 13.0 v dynamic resistance r dyn (v c2 - v c1 ) / (i pp2 - i pp1 ) 1. 7 esd withstand voltage 1,2 v esd iec61000-4-2 (contact) 15 kv iec61000-4-2 (air) 30 kv diode capacitance 1 c d reverse bias=0v 12 pf reverse bias=2.5v 8 pf reverse bias=5v 7 pf notes: 1 parameter is guaranteed by device characterization 2 a minimum of 1,000 esd pulses are applied at 1s intervals between the anode and common cathode of each diode thermal information parameter rating units storage temperature range C55 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 20s-40s) 260 c capacitance vs. reverse bias dc bi as (v ) capacitance (pf) design consideration because of the fast rise-time of the esd transient, placement of esd devices is a key design consideration. to achieve optimal esd suppression, the devices should be placed on the circuit board as close to the source of the esd transient as possible. install the esd suppressors directly behind the connector so that they are the frst board-level circuit component encountered by the esd transient. they are connected from signal/data line to ground. tvs diode arrays (spa ? diodes) general purpose esd protection - sp1001 series
? 2017 littelfuse, inc. specifcations are subject to change without notice. revised: 02/23/17 ti me te mperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zo n e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters part numbering system ordering information part number package marking min. order qty. sp1001-02jtg sc70-3 a*2 3000 sp1001-02xtg sot553 a*2 3000 sp1001-04jtg sc70-5 a*4 3000 sp1001-04xtg sot553 a*4 3000 sp1001-05jtg sc70-6 a*5 3000 sp1001-05vtg sot963 a*5 8000 sp1001-05xtg sot563 a*5 3000 part marking system sp 1001 -0** t g series number of channels 02 = 2 channel 04 = 4 channel 05 = 5 channel package j = sc70-3, sc70-5 or sc70-6 x = sot553 or sot563 v = sot963 t= tape & reel g= green tvs diode arrays (spa ? diodes) product characteristics lead plating matte tin (sc70-x) pre-plated frame (sot5x3, sot963) lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) substitute material silicon body material molded epoxy flammability ul 94 v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. package surface matte fnish vdi 11-13. a** a * * product series a = sp1001 series assembl y site (varies) number of channels (varies) tvs diode arrays (spa ? diodes) general purpose esd protection - sp1001 series
? 2017 littelfuse, inc. specifcations are subject to change without notice. revised: 02/23/17 package dimensions sc70 b 3 e he 2 1 e e d a2 a a1 c l package sc70-3 pins 3 jedec mo-203 millimeters inches min max min max a 0.80 1. 10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1. 0 0 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1. 15 1.35 0.045 0.053 e 0.66 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 package sc70-6 pins 6 jedec mo-203 millimeters inches min max min max a 0.80 1. 10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1. 0 0 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1. 15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 d a2 a a1 c l e he 2 1 3 6 5 4 b b b d a2 a a1 c l e he 2 1 3 6 5 not used 4 e e b package sc70-5 pins 5 jedec mo-203 millimeters inches min max min max a 0.80 1. 10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1. 0 0 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1. 15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 sc70-5 solder pad layout sc70-6 solder pad layout sc70-3 solder pad layout tvs diode arrays (spa ? diodes) general purpose esd protection - sp1001 series
? 2017 littelfuse, inc. specifcations are subject to change without notice. revised: 02/23/17 package dimensions sot553 and sot563 package sot 553 pins 5 millimeters inches min max min max a 0.50 0.60 0.020 0.024 b 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 d 1.50 1.70 0.059 0.067 e 1. 10 1.30 0.043 0.051 e 0.50 bsc 0.020 bsc l 0.10 0.30 0.004 0.012 he 1.50 1.70 0.059 0.067 5 (not used) c he l a d 6 4 2 3 e e b package sot 563 pins 6 millimeters inches min max min max a 0.50 0.60 0.020 0.024 b 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 d 1.50 1.70 0.059 0.067 e 1. 10 1.30 0.043 0.051 e 0.50 bsc 0.020 bsc l 0.10 0.30 0.004 0.012 he 1.50 1.70 0.059 0.067 c he l a d 6 4 2 3 e e b 5 sot 553 solder pad layout sot 563 solder pad layout r ecommanded s older p ad layout package dimensions sot963 package sot 963 pins 6 millimeters inches min nom max min nom max a 0.44 0.48 0.50 0.0173 0.0189 0.0197 b 0.10 0.15 0.20 0.004 0.006 0.008 c 0.05 0.10 0.15 0.002 0.004 0.006 d 0.95 1. 0 0 1.05 0.037 0.039 0.041 e 0.75 0.80 0.85 0.029 0.031 0.033 e1 0.95 1. 0 0 1.05 0.037 0.039 0.041 e 0.35 bsc 0.014 bsc l 0.05 0.10 0.15 0.002 0.004 0.006 l1 0.125 0.15 0.175 0.005 0.006 0.007 ? 3 o 5 o 7 o 3 o 5 o 7 o tvs diode arrays (spa ? diodes) general purpose esd protection - sp1001 series
? 2017 littelfuse, inc. specifcations are subject to change without notice. revised: 02/23/17 embossed carrier tape & reel speci f cation sc70-5 and sc70-6 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 1. 0 0 1.25 0.039 0.049 p0 3.90 4.10 0.154 0.161 10p0 40.0 0.20 1.574 0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 2.14 2.34 0.084 0.092 b0 2.24 2.44 0.088 0.096 k0 1. 12 1.32 0.044 0.052 t 0.27 max 0.010 max dimensions embossed carrier tape & reel speci f cation sc70-3 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 1. 0 0 1.25 0.039 0.049 p0 3.90 4.10 0.154 0.161 10p0 40.0 0.20 1.574 0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 2.30 2.50 0.090 0.098 a1 1.00 ref 0.039 ref b0 2.30 2.50 0.090 0.098 b1 1.90 ref 0.074 k0 1. 10 1.30 0.043 0.051 k1 0.60 ref 0.023 ref t 0.27 max 0.010 dimensions tvs diode arrays (spa ? diodes) general purpose esd protection - sp1001 series
? 2017 littelfuse, inc. specifcations are subject to change without notice. revised: 02/23/17 embossed carrier tape & reel specifcation C sot963 symbol millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.136 0.140 d1 0.45 0.55 0.018 0.022 d 1.50 min 0.059 min p0 3.90 4.10 0.154 0.161 10p0 40.0 0.20 1.575 0.008 p 1.95 2.05 0.077 0.081 p2 1.95 2.05 0.077 0.081 w 7.90 8.20 0.311 0.323 a0 1. 11 1.21 0.044 0.048 b0 1. 11 1.21 0.044 0.048 k0 0.58 0.68 0.023 0.027 t 0.22 max 0.009 max po p2 od / f e w bo t p od1 / ao ko embossed carrier tape & reel speci f cation sot553 and sot563 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 0.45 0.55 0.017 0.021 p0 3.90 4.1 0.154 0.161 10p0 40.0 0.20 1.574 0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 1.73 1.83 0.068 0.072 b0 1.73 1.83 0.068 0.072 k0 0.64 0.74 0.025 0.029 t 0.22 max .009 max dimensions dimensions disclaimer notice - information furnished is believed to be accurate and reliable. however, users should independently evaluate the suitability of and test each product selected for their own applications. littelfuse products are not designed for, and may not be used in, all applications. read complete disclaimer notice at www.littelfuse.com/disclaimer-electronics . tvs diode arrays (spa ? diodes) general purpose esd protection - sp1001 series
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